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| Name | Last modified | Size | Description |
|---|---|---|---|---|
| Parent Directory | - | ||
| ACF_ACA Flip-Chip bonding process chapter3.pdf | 2013-11-16 08:43 | 1.2M | |
| ACHIEVING OPTIMUM ADHESION OF CONDUCTIVE.pdf | 2013-11-16 09:01 | 165K | |
| Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs).pdf | 2013-11-16 08:48 | 3.1M | |
| Flip Chip on FPC.pdf | 2013-11-16 09:22 | 67K | |
| White-paper-ACF-Bonding-Technology-08-10.pdf | 2013-11-05 11:43 | 1.6M | |
| download (2).jpg | 2013-11-16 09:25 | 8.1K | |
| download (3).jpg | 2013-11-16 09:25 | 11K | |
| download (4).jpg | 2013-11-16 09:25 | 8.8K | |
| download (5).jpg | 2013-11-16 09:26 | 9.3K | |
| download (6).jpg | 2013-11-16 09:26 | 12K | |
| download.jpg | 2013-11-16 09:24 | 3.9K | |
| images (1).jpg | 2013-11-16 09:26 | 6.2K | |
| images (2).jpg | 2013-11-16 09:27 | 9.9K | |
| images (3).jpg | 2013-11-16 09:29 | 7.8K | |
| images.jpg | 2013-11-16 09:26 | 3.9K | |
| mediawebserver_mwsId=66666UF6EVsSyXTtnxTXoxT_EVtQEVs6EVs6EVs6E666666--&fn=04437.pdf | 2013-11-05 11:43 | 182K | |