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![]() | Parent Directory | - | ||
![]() | White-paper-ACF-Bonding-Technology-08-10.pdf | 2013-11-05 11:43 | 1.6M | |
![]() | mediawebserver_mwsId=66666UF6EVsSyXTtnxTXoxT_EVtQEVs6EVs6EVs6E666666--&fn=04437.pdf | 2013-11-05 11:43 | 182K | |
![]() | ACF_ACA Flip-Chip bonding process chapter3.pdf | 2013-11-16 08:43 | 1.2M | |
![]() | Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs).pdf | 2013-11-16 08:48 | 3.1M | |
![]() | ACHIEVING OPTIMUM ADHESION OF CONDUCTIVE.pdf | 2013-11-16 09:01 | 165K | |
![]() | Flip Chip on FPC.pdf | 2013-11-16 09:22 | 67K | |
![]() | download.jpg | 2013-11-16 09:24 | 3.9K | |
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